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2SC5700
Silicon NPN Epitaxial VHF/UHF wide band amplifier
REJ03G0751-0100 (Previous ADE-208-1435) Rev.1.00 Aug.10.2005
Features
* High power gain low noise figure at low power operation: |S21|2 = 16 dB typ, NF = 1.0 dB typ (VCE = 1 V, IC = 5 mA, f = 900 MHz)
Outline
RENESAS Package code: PUSF0003ZA-A (Package name: MFPAK R )
3
1 2
1. Emitter 2. Base 3. Collector
Note: Marking is "WB-". *MFPAK is a trademark of Renesas Technology Corp.
Absolute Maximum Ratings
(Ta = 25C)
Parameter Collector to base voltage Collector to emitter voltage Emitter to base voltage Collector current Collector power dissipation Junction temperature Storage temperature Symbol VCBO VCEO VEBO IC Pc Tj Tstg Value 15 4 1.5 50 80 150 -55 to +150 Unit V V V mA mW C C
Rev.1.00 Aug 10, 2005 page 1 of 8
2SC5700
Electrical Characteristics
(Ta = 25C)
Item Collector to base breakdown voltage Collector cutoff current Collector cutoff current Emitter cutoff current DC current transfer ratio Collector output capacitance Gain bandwidth product Forward transmission coefficient Noise figure Symbol V(BR)CBO ICBO ICEO IEBO hFE Cob fT |S21|2 NF Min 15 100 10 13 Typ 130 0.4 12 16 1.0 Max 0.1 1 200 170 0.7 1.7 Unit V A A nA pF GHz dB dB Test conditions IC = 10 A, IE = 0 VCB = 15 V, IE = 0 VCE = 4 V, RBE = VEB = 0.8 V, IC = 0 VCE = 1 V, IC = 5 mA VCB = 1 V, IE = 0, f = 1 MHz VCE = 1V, IC = 5 mA VCE = 1 V, IC = 5 mA, f = 900 MHz VCE = 1 V, IC = 5 mA, f = 900 MHz, ZS = ZL = 50
Rev.1.00 Aug 10, 2005 page 2 of 8
2SC5700
Main Characteristics
Collector Power Dissipation Curve
Pc (mW)
100 50
Typical Output Characteristics
450 A
0 A
400 A
80
IC (mA)
50
350 A
300 A
250 A
40
Collector Power Dissipation
Collector Current
60
30
200 A
150 A
100 A
40
20
20
10
IB = 50 A
0
50
100
150
200
0
1
2
3
4
Ambient Temperature
Ta (C)
Collector to Emitter Voltage VCE (V) DC Current Transfer Ratio vs. Collector Current
hFE
200 VCE = 1 V
Typical Transfer Characteristics
50 VCE = 1 V
IC (mA)
40
Collector Current
30
DC Current Transfer Ratio
100
20
10
0 0 0.2 0.4 0.6 0.8 1 1 2 5 10 20 50 100
Base to Emitter Voltage
VBE (V)
Collector Current
IC (mA)
Collector Output Capacitance Cob (pF)
Collector Output Capacitance vs. Collector to Base Voltage
fT (GHz)
1.0 IE = 0 f = 1 MHz 0.8 20
Gain Bandwidth Product vs. Collector Current
VCE = 1 V f = 2 GHz
16
0.6
Gain Bandwidth Product
0.4 0.8 1.2 1.6 2.0
12
0.4
8
0.2
4 0 1 2 5 10 20 50 100
0
Collector to Base Voltage VCB (V)
Collector Current IC (mA)
Rev.1.00 Aug 10, 2005 page 3 of 8
2SC5700
S21 Parameter vs. Collector Current
20 20
S21 Parameter vs. Collector Current
| S21 |2 (dB) S21 Parameter
| S21 |2 (dB)
VCE = 1V f = 2 GHz 16
16
12
12
S21 Parameter
8
8 VCE = 1 V f = 900 MHz
4 0 1 2 5 10 20 50 100
4 0 1 2 5 10
20
50
100
Collector Current IC (mA)
Collector Current
IC (mA)
Noise Figure vs. Collector Current
5 VCE = 1 V f = 900 MHz 4
NF (dB) Noise Figure
3
2
1 0 1 2 5 10 20 50 100
Collector Current IC (mA)
Rev.1.00 Aug 10, 2005 page 4 of 8
2SC5700
S21 Parameter vs. Frequency
90 2 .4 3 .2 4 5 10 0 .2 .4 .6 .8 1 1.5 2 3 45 10 -10 -.2 -5 -4 -3 -.4 -.6 -.8 -1.5 -2
-120
S11 Parameter vs. Frequency
.8 .6 1 1.5
Scale: 8 / div.
60
120
150
30
180
0
-150
-30
-60 -90
-1
Condition: VCE = 1 V , ZO = 50 100 to 2000 MHz (100 MHz Step) ( IC = 5 mA) ( IC = 20 mA) S12 Parameter vs. Frequency Scale: 0.06 / div.
90 120 60
Condition: VCE = 1 V , ZO = 50 100 to 2000 MHz (100 MHz Step) ( IC = 5 mA) ( IC = 20 mA) S22 Parameter vs. Frequency
.8 .6 .4 3 1 1.5 2
150
30 .2
4 5 10
180
0
0
.2
.4
.6 .8 1
1.5 2
3 45
10
-10
-.2 -150 -30 -.4 -120 -90 -60 -.6 -.8 -1.5 -2 -1
-5 -4 -3
Condition: VCE = 1 V , ZO = 50 100 to 2000 MHz (100 MHz Step) ( IC = 5 mA) ( IC = 20 mA)
Condition: VCE = 1 V , ZO = 50 100 to 2000 MHz (100 MHz Step) ( Ic = 5 mA) ( Ic = 20 mA)
Rev.1.00 Aug 10, 2005 page 5 of 8
2SC5700
Sparameter
(VCE = 1V, IC = 5mA, Zo = 50)
S11 f (MHz) 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 1900 2000 MAG 0.855 0.784 0.703 0.616 0.540 0.475 0.428 0.385 0.348 0.320 0.297 0.283 0.271 0.262 0.254 0.246 0.248 0.249 0.253 0.253 ANG -16.3 -32.7 -48.4 -60.4 -72.1 -81.4 -90.3 -99.1 -106.5 -113.6 -121.6 -128.8 -134.6 -142.4 -149.0 -155.3 -160.8 -167.3 -172.0 -177.5 MAG 15.67 14.42 12.92 11.41 10.09 8.94 8.00 7.23 6.54 6.00 5.51 5.14 4.80 4.47 4.23 3.99 3.79 3.59 3.44 3.29 S21 ANG 165.4 152.1 140.6 131.2 123.5 117.2 112.3 108.2 104.2 100.9 98.2 95.4 93.1 90.8 89.0 87.0 85.3 83.7 81.9 80.5 MAG 0.018 0.035 0.048 0.059 0.067 0.074 0.080 0.085 0.091 0.096 0.101 0.106 0.111 0.117 0.122 0.128 0.134 0.140 0.145 0.151 S12 ANG 81.2 72.2 65.3 61.2 58.6 57.3 56.6 56.1 56.3 57.3 57.4 57.8 58.7 59.2 60.0 60.5 61.1 61.5 62.1 62.7 MAG 0.962 0.889 0.791 0.698 0.618 0.549 0.492 0.445 0.404 0.373 0.344 0.321 0.298 0.283 0.263 0.252 0.238 0.226 0.215 0.204 S22 ANG -10.7 -20.9 -28.9 -34.6 -38.2 -40.7 -42.1 -42.5 -42.7 -42.0 -41.6 -40.7 -39.1 -37.5 -36.3 -34.6 -33.0 -31.3 -29.6 -27.2
Rev.1.00 Aug 10, 2005 page 6 of 8
2SC5700
Sparameter
(VCE = 1V, IC = 20mA, Zo = 50)
S11 f (MHz) 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 1900 2000 MAG 0.526 0.406 0.334 0.284 0.263 0.243 0.242 0.236 0.230 0.239 0.240 0.247 0.246 0.255 0.257 0.265 0.268 0.282 0.283 0.300 ANG -43.0 -76.6 -100.0 -116.6 -131.4 -143.4 -152.6 -159.6 -167.8 -173.4 -179.4 175.6 172.4 167.4 163.8 160.2 158.7 154.1 152.7 150.3 MAG 37.91 27.98 20.76 16.30 13.33 11.24 9.74 8.57 7.62 6.91 6.31 5.82 5.38 5.02 4.71 4.45 4.19 3.97 3.80 3.63 S21 ANG 148.3 127.5 115.3 108.1 103.0 99.2 96.3 93.6 91.4 89.4 87.7 85.9 84.4 82.9 81.3 80.1 78.9 77.6 76.4 75.4 MAG 0.015 0.025 0.033 0.040 0.047 0.055 0.063 0.071 0.078 0.086 0.094 0.102 0.110 0.117 0.126 0.134 0.142 0.149 0.157 0.165 S12 ANG 75.0 67.3 66.9 68.0 69.8 71.1 72.0 72.7 73.5 74.1 73.9 74.1 74.4 74.3 74.2 74.4 74.2 73.9 74.1 73.7 MAG 0.817 0.605 0.453 0.360 0.300 0.257 0.226 0.203 0.184 0.170 0.160 0.150 0.143 0.138 0.133 0.130 0.128 0.125 0.123 0.123 S22 ANG -25.2 -40.0 -45.9 -47.1 -46.2 -44.4 -41.4 -38.2 -34.3 -30.5 -26.8 -22.6 -18.1 -14.0 -9.6 -5.3 -1.2 2.5 7.1 11.8
Rev.1.00 Aug 10, 2005 page 7 of 8
2SC5700
Package Dimensions
JEITA Package Code SC-89 Modified RENESAS Code PUSF0003ZA-A Package Name MFPAK / MFPAKV MASS[Typ.] 0.0016g
D e
A c
LP
E
HE
L A A b xM S A
Reference Symbol Dimension in Millimeters
e
A2
A
e1 A1 b b1 c b2 A-A Section Pattern of terminal position areas c1 S I1
A A1 A2 b b1 c c1 D E e HE L LP x b2 e1 I1
Min 0.55 0 0.55 0.15 0.1 1.35 0.7 1.15 0.1 0.15
Nom
0.22 0.2 0.13 0.11 1.4 0.8 0.45 1.2 0.2
Max 0.6 0.01 0.59 0.3 0.15 1.45 0.9 1.25 0.3 0.45 0.05 0.35 0.5
0.75
Ordering Information
Part Name 2SC5700WB-TR-E Quantity 9000 Shipping Container 178 mm Reel, 8 mm Emboss Taping
Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product.
Rev.1.00 Aug 10, 2005 page 8 of 8
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
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Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> 2-796-3115, Fax: <82> 2-796-2145
http://www.renesas.com
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